Counterfeit products of all types have been a growing problem for almost every industry sector in recent years, and the electronics industry has been no exception.
The ultimate goal in counterfeit analysis is to arrive to an accurate determination of the cause of the failure. 1st Components Test Lab developed failure analyses that are very effective. If customized testing services are required, our talented engineering team will work directly with the customer to accommodate their needs.
AS6081 Electrical Level Testing, the objective of Aero Testing is to determine the quality of each product to avoid counterfeit distribution or production that meets complience of AS6081 criteria. This is accomplished by running a suite of tests or check comformity and clerify the validity of hte devices.
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| | LEVEL 1 | LEVEL 2 | LEVEL 3 |
|---|
| TEST QUANTITY |
Sample** or 100% |
| TEST TEMPERATURE |
25°C |
25°C, C=Comm I=Ind. M=Mil |
25°C, C=Comm I=Ind. M=Mil |
| GENERAL TEST PLAN PER DEVICE TYPE |
Passive and Discretes: Targets Process Oriented DC Parameters and Tolerances. |
Simple Analog or Digital: Targets Process Oriented DC Parameters and Timing Analysis. |
Passive and Discretes: Targets Process Oriented DC Parameters and Tolerances. |
| Simple Analog or Digital: Targets Process Oriented DC Parameters. |
Memory Devices (non SRAM): Program, Verify, Blank Check, and IDCODE. DC Parameters |
Simple Analog or Digital: Targets Process Oriented DC Parameters. |
| Memory Devices (non SRAM): Program, Verify, Blank Check, and IDCODE. |
|
Memory Devices (non SRAM): Program, Verify, Blank Check, and IDCODE. |
| SRAM Memory Devices: Full Memory Test, Access Times, Data Retention |
|
SRAM Memory Devices: Full Memory Test, Access Times, Data Retention |
| High Pin Count and Complex Devices: Process Oriented Pin Correlation |
|
FPGA: Configuration and Readback testing and/or IDCODE |
| TEST/INSPECTION IN ACCORDANCE WITH AS6081 |
|---|
| MINIMUM REQUIRED TESTS |
MINIMUM SAMPLE SIZE* |
| Lot Size 200 or Greater Devices |
Lot Size 1-199 Devices |
| Document and Packaging Inspection |
All Devices |
All Devices |
| General External Visual Inspection |
All Devices |
All Devices |
| Detailed External Visual Inspection |
122 Devices |
122 or all Devices, whichever is less |
| Solvent Test for Remarking and Resurfacing |
3 Devices |
3 Devices |
| X-Ray Inspection |
45 Devices |
45 or all Devices, whichever is less |
| XRF Analysis |
3 Devices |
3 Devices |
| Internal Visual Inspection (Decapsulation) |
3 Devices |
3 Devices |
| Solderability Testing (Optional) |
3 Devices |
3 Devices |
MINIMUM SAMPLE SIZE* per AS6081
|
